By Topic

Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694]

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hejase, J. A. ; Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA ; Paladhi, P. R. ; Chahal, P. P.

In the above titled paper (ibid., vol. 1, no. 11, pp. 1685-1694, Nov. 2011), Figs. 3(a), (b), and 5(b) are incorrect. The correct versions are presented here.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:3 ,  Issue: 2 )