By Topic

Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Frederick Bossuyt ; IMEC/Ghent University, Zwijnaarde, Belgium ; Thomas Vervust ; Jan Vanfleteren

The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10-15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It's shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:3 ,  Issue: 2 )