Cart (Loading....) | Create Account
Close category search window
 

Series-Fed Microstrip Antenna Array With Inclined-Slot Couplers as Three-Way Power Dividers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Slomian, I. ; Dept. of Electron., AGH Univ. of Sci. & Technol., Cracow, Poland ; Wincza, K. ; Gruszczynski, S.

A novel approach to the design of series-fed antenna arrays has been presented, in which a modified three-way slot power divider is applied. In the proposed coupler, the power division is adjusted by changing the slot inclination with respect to the transmission line, whereas coupled transmission lines are perpendicular. The proposed modification reduces electrical length of the feeding line to 1 λ, hence results in dissipation losses' reduction. The theoretical analysis and measurement results of the 2 × 8 microstrip antenna array operating within 10.5-GHz frequency range are shown in the letter, proving the novel inclined-slot power divider's capability to provide appropriate power distribution and its potential application in the large antenna arrays.

Published in:

Antennas and Wireless Propagation Letters, IEEE  (Volume:12 )

Date of Publication:

2013

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.