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In this paper we summarize the first steps of a new idea to create cost effective microcooler structures with high performance. Our basic idea is to use a cheap etching process instead of reactive ion etching or LIGA technologies. However before we go further into varying the layout in order to increase the cooling efficiency, the performances of the new structures have to be compared against others which were formed either by RIE or LIGA. In order to validate our structures' cooling capability thermal transient tests were performed. These tests proved are expectation as the cooling efficiencies were almost identical.