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Modeling of Vias Sharing the Same Antipad in Planar Waveguide With Boundary Integral Equation and Group T-Matrix Method

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2 Author(s)
Leung Tsang ; Department of Electrical Engineering, University of Washington, Seattle, WA, USA ; Xin Chang

We consider multiple scattering among different groups of vias with each group of vias sharing one antipad in planar waveguide. A transformation is used that converts the 2-D discretization and 2-D surface integration of the product of Green's functions and magnetic surface currents into 1-D discretization and 1-D integration of surface charges on the vias and on the ground plane. This is used to calculate the incident fields onto the vias. Based on the incident fields, the Foldy-Lax equations can be solved to calculate the circuit parameters for the problem. We show that the results are superior to the previously used finite difference method. In addition, the group T-matrix method is used to represent a group of vias to account for the scattering among different groups of vias. Results are illustrated for various cases of multiple vias up to 20 GHz. Results show the accuracy of the method even to very closely spaced vias when they are separated by merely 1 mil. Numerical results are in excellent agreement with ANSOFT HFSS.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:3 ,  Issue: 2 )