By Topic

Oven Sintering Process Optimization for Inkjet-Printed Ag Nanoparticle Ink

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Eerik Halonen ; Department of Electronics, Tampere University of Technology, Tampere, Finland ; Tanja Viiru ; Kauko Ostman ; Ana Lopez Cabezas
more authors

This paper focuses on optimizing the oven sintering time and temperature for inkjet-printed silver nanoparticle ink on a polyimide substrate. Two basic aspects in fabricating conductor structures in printable electronics are conductivity and adhesion between the ink and the substrate material. Conductivity evolution during oven sintering is monitored with real-time resistance measurements at five different temperatures. Based on conductivity results, adhesion is evaluated at several time points at three temperatures. The higher the sintering temperature, the faster the structures reach their maximum conductivity values. The lowest conductor resistivity values are below 4 μΩ· cm. However, at each sintering temperature, it takes longer to reach the best adhesion values. In this paper, we aim to better understand oven sintering of silver nanoparticles and determine the best oven sintering conditions (temperature, time) for our particular ink-substrate combination. The results can be used to further define optimum sintering conditions for printed nanoparticle inks on polymer substrates.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:3 ,  Issue: 2 )