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Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes

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5 Author(s)
Alimenti, F. ; Dept. of Electronic and Information Engineering, University of Perugia, Perugia, Italy ; Mezzanotte, P. ; Dionigi, M. ; Virili, M.
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In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz.

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Microwave and Wireless Components Letters, IEEE  (Volume:22 ,  Issue: 12 )