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Limitations of nanoparticle enhanced solder pastes for electronics assembly

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4 Author(s)
Hiren R. Kotadia ; BCAST/Division of Engineering, Brunel University, UB8 3PH, UK ; Arunkumar Panneerselvam ; Mark A. Green ; Samjid H. Mannan

This paper reviews the limitations discovered recently in using nanoparticles to enhance solder pastes and discusses possible solutions to these problems. The motivation for introducing nanoparticles to reduce creep and excessive Intermetallic Compound (IMC) formation, especially for high temperature applications is first discussed. Next, the theoretical and practical limitations found for nanoparticle technology to enhance solder paste are given, together with possible solutions to these problems.

Published in:

Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on

Date of Conference:

20-23 Aug. 2012