Limitations of nanoparticle enhanced solder pastes for electronics assembly

This paper reviews the limitations discovered recently in using nanoparticles to enhance solder pastes and discusses possible solutions to these problems. The motivation for introducing nanoparticles to reduce creep and excessive Intermetallic Compound (IMC) formation, especially for high temperature applications is first discussed. Next, the theoretical and practical limitations found for nanoparticle technology to enhance solder paste are given, together with possible solutions to these problems.