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Packageless AlN/ZnO/Si Structure for SAW Devices Applications

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5 Author(s)
Legrani, O. ; Inst. Jean Lamour, Univ. de Lorraine, Vandoeuvre, France ; Elmazria, O. ; Zhgoon, S. ; Pigeat, P.
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The possibility to perform a packageless structure for acoustic wave sensors applications based on AlN/interdigital transducer/ZnO/Si structure was investigated. The effect of thicknesses of AlN and ZnO thin films on structure performance was simulated by 2-D finite element method. Theoretical predictions were confirmed by in-situ measurements of frequency, insertion loss, and thickness during deposition of AlN layer on ZnO/Si.

Published in:

Sensors Journal, IEEE  (Volume:13 ,  Issue: 2 )

Date of Publication:

Feb. 2013

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