A comparison of processes and challenges between organic, a-Si:H, and oxide TFTs for active matrix backplanes on plastic

Processes to produce active-matrix backplanes on plastic substrates have been developed utilizing a-Si:H, multi-component oxide, and organic semiconductor technologies. The suitability of these technologies for future flat panel display applications is discussed. Of these material systems multi-component oxides exhibit highest field-effect mobilities (10cm
²
/Vs for zinc tin oxide demonstrated), followed by small molecule organic semiconductors (0.95 cm
²
/Vs), and a-Si:H (0.5 cm
²
/Vs). Yet despite higher mobilities, organic TFTs drive less current than a-Si:H because of the low device capacitances required to fabricate such devices. Backplanes made with a-Si:H appear to be the least risky technology, followed by multi-component oxide, and organic semiconductor technologies.