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Approaches to obtain monolithic 3D logic and memory ICs are proposed in this paper. 3-4x higher memory density with similar litho cost can be obtained with monolithic 3D memories, while benefits similar to a generation of scaling can be obtained with monolithic 3D logic by doubling the number of device layers. Well-known, manufacturing-friendly materials, process steps and device structures are used.
Date of Conference: Jan. 31 2012-Feb. 2 2012