Referenced Items are not available for this document.
Approaches to obtain monolithic 3D logic and memory ICs are proposed in this paper. 3-4x higher memory density with similar litho cost can be obtained with monolithic 3D memories, while benefits similar to a generation of scaling can be obtained with monolithic 3D logic by doubling the number of device layers. Well-known, manufacturing-friendly materials, process steps and device structures are used.
Published in:
3D Systems Integration Conference (3DIC), 2011 IEEE International
Date of Conference: Jan. 31 2012-Feb. 2 2012
- Page(s):
- 1 - 2
- Print ISBN:
- 978-1-4673-2189-1
- INSPEC Accession Number:
- 12943893
- Conference Location :
- Osaka
- Digital Object Identifier :
- 10.1109/3DIC.2012.6262978
- Product Type:
- Conference Publications
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