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Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration

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5 Author(s)
Yuki Ohara ; Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan ; Lee Kangwook ; Takafumi Fukushima ; Tetsu Tanaka
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We developed a novel detachable bonding process by controlling wettability of a bonding surface. A high hydrophobic surface was formed in the bonding area for adhesion blocking. We applied an adhesive material with high thermal resistance at around 350 °C. In this paper, the bonding characteristics of the novel detachable bonding process was estimated by evaluating the shear strength and the dissolution time of adhesive material varying the ratio of hydrophobic area to the hydrophilic area using 5 mm2 size chip. Based on the evaluation results of the shear strength and the de-bonding time, 10 % of the hydrophilic area is suitable condition for our novel chip-level 3D integration process.

Published in:

3D Systems Integration Conference (3DIC), 2011 IEEE International

Date of Conference:

Jan. 31 2012-Feb. 2 2012