High performance screen printable silicone as selective hybrid IC encapsulant

A solvent-, flux-, and detergent-resistant screen-printable silicone (SPS) with a modest curing temperature and excellent adhesion to gold-plated substrate integrated circuits is described. The material formulation and need for an encapsulant with the above properties is described. Microdielectrometry was used to define the precise SPS cure schedule. Temperature humidity bias was used to qualify the material's electrical performance. Auger spectroscopy and laser ionization mass spectrometry were used to further elucidate the crosslinking density and the interfacial interaction of the SPS and encapsulated substrate.<
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