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Browse Journals & Magazines > Components, Hybrids, and Manu ...> Volume:13 Issue:4 Help

A comparison of copper and gold wire bonding on integrated circuit devices

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4 Author(s)
Khoury, S.L. ; Motorola Semicond. Products Inc., Mesa, AZ, USA ; Burkhard, D.J. ; Galloway, D.P. ; Scharr, T.A.

A study carried out to investigate the process and material variables in developing a copper wire bond assembly process and to determine the potential performance and reliability of the finished product. A summary of Cu and Au comparison results for die bond, material selection, ball shear, and wire pull evaluations is given. The electrical and thermal performances are described. The intermetallics and reliability results are discussed

Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )

Date of Publication: Dec 1990

Page(s):
673 - 681
ISSN :
0148-6411
INSPEC Accession Number:
3848351
Digital Object Identifier :
10.1109/33.62578
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Dec 1990
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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