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A comparison of copper and gold wire bonding on integrated circuit devices

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4 Author(s)
S. L. Khoury ; Motorola Semicond. Products Inc., Mesa, AZ, USA ; D. J. Burkhard ; D. P. Galloway ; T. A. Scharr

A study carried out to investigate the process and material variables in developing a copper wire bond assembly process and to determine the potential performance and reliability of the finished product. A summary of Cu and Au comparison results for die bond, material selection, ball shear, and wire pull evaluations is given. The electrical and thermal performances are described. The intermetallics and reliability results are discussed

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 4 )