By Topic

Prototype packages in aluminum nitride for high performance electronic systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Lodge, K.J. ; Plessey Res. Caswell Ltd., Towcester, UK ; Sparrow, J.A. ; Perry, E.D. ; Logan, E.A.
more authors

The way in which many standard processing techniques such as laser cutting, thick and thin film deposition, glassing and soldering can be used with aluminum nitride is illustrated, and some of the ways in which material and process compatibilities can be achieved are highlighted. The viability of such techniques is demonstrated by the production of aluminum nitride prototype packages and substrates using thick-film and thin-film technologies. Substrate preparation, package walls, lid sealing, and leads are discussed

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )