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High performance air cooled heat sinks for integrated circuits

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4 Author(s)
C. Hilbert ; Microelectron. & Comput. Technol. Corp., Austin, TX, USA ; S. Sommerfeldt ; O. Gupta ; D. J. Herrell

A simple, compact, high-performance air cooling technology is described that combines laminar flow with certain heat-sink designs to achieve a cooling performance of <2°C/W/cm2 at 2 ft 3/min. It has the capability to remove in excess of 600 W from a multichip module (25 chips at 25 W and 16% chip-to-substrate coverage) with a quiet 10-W tubeaxial fan. The volume of the complete module including the plenum and the fan is only about 1 l. The chips are held to maximum temperature rise of 55°C. Even higher cooling performance at greater chip-to-substrate coverage is shown to be possible with larger air movers. This technology extends the applicability of air cooling to the power levels of complex liquid-cooled modules

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:13 ,  Issue: 4 )