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Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design

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2 Author(s)
Hong You ; Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA ; Soma, M.

An approach to the crosstalk and transient analysis of high-speed interconnects which are modeled as multiconductor transmission lines is presented. Closed-form formulas are derived for determining the voltage and current transfer functions based on the spectral-domain modal analysis technique. The transfer function is then expanded to its Taylor series form and the inverse Fourier transform is applied to the significant terms in the series. Analytical expressions of time-domain signal waveforms are consequently obtained. In addition to providing valuable insight into the coupling mechanism, results of the study facilitate the efficient computation of crosstalk, propagation delay, signal reflection, and waveform distortion

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 4 )