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This letter proposes simple guidelines to design nanoscale fin-based multigate field-effect transistors (FinFETs) for radio frequency (RF)/analog applications in terms of fin height and fin spacing. Geometry-dependent capacitive and resistive parasitics are evaluated using analytic models and are included in a small-signal circuit. It is found that reducing the fin-spacing-to-fin-height ratio of FinFETs, as long as it is compatible with the process integration, is desirable for improving RF performance. This is because the current-gain cutoff frequency and the maximum oscillation frequency are affected by decreasing parasitic capacitance more than by increasing series resistance.