Referenced Items are not available for this document.
We present a new interconnect/chip-attach technology that provides high volumetric efficiency for systems that are not I/O bound, while also providing low weight, good thermal management and low cost. This attach technology, perpendicular chip attach, is well-suited for applications such as memory modules, mixed-signal systems integration, and high-density microelectromechanical systems (MEMS)
Published in:
Memory Technology, Design and Testing, 1997. Proceedings., International Workshop on
Date of Conference: 11-12 Aug 1997
- Page(s):
- 2 - 7
- Meeting Date :
- 11 Aug 1997-12 Aug 1997
- ISSN :
- 1087-4852
- Print ISBN:
- 0-8186-8099-7
- INSPEC Accession Number:
- 5766672
- Conference Location :
- San Jose, CA
- Digital Object Identifier :
- 10.1109/MTDT.1997.619387
- Product Type:
- Conference Publications
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