Lumped inductors are very desirable passive components in wireless/RF circuits integrated on multichip module (MCM) substrates. This paper models the inductor by using on-wafer high frequency measurement, S parameter formulation and exponential gradient optimization method. A new equivalent circuit model including both lumped and distributed effects is proposed. Both the magnitudes and phases of all S parameters fit well for all the inductors we built. It is shown that the most effective way to increase the quality factor is to use a high resistivity substrate. The resulting experimental model provides a solid measurement-verified ground for circuit design and numerical characterization
Published in:
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
(Volume:20
,
Issue:
3
)
Date of Publication: Aug 1997