By Topic

High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kouters, M.H.M. ; Mater. Performance Group, TNO Tech. Sci., Eindhoven, Netherlands ; Ubachs, R. ; van de Wiel, H.J. ; van der Waal, A.
more authors

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic solder joint loading (sinus wave load, 10-200 Hz, <;2 mm peak-to-peak). A series of test printed circuit boards with wafer level chip scale packages (WLCSP) and Micropearl SOL lead-free solder balls arrays are daisy-chain interconnected and in-situ monitored to detect failure during loading. After failure defect interconnects are cross sectioned for fractography to determine the corresponding failure mechanism. To determine the maximum stress and strain levels finite element modeling (FEM) is used and compared with the results from HSB testing. Finally, a proof of concept is done for the high speed bending test. Further verification is necessary to use this test as qualification for 2nd level interconnect qualification of automotive electronics.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011