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Inverse modeling of the button shear test

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3 Author(s)
Hauck, T. ; Freescale Halbleiter Deutschland GmbH, Germany ; Min Ding ; Schmadlak, I.

This paper presents computational fracture analysis of the button shear test. The specimen under consideration is commonly used for the assessment of adhesion strength between encapsulating mold compounds and metal leadframes. The finite element method is applied for stress strain analysis of the shear test and for the extraction of fracture parameters for various crack configurations in the material interface. Impacts of geometry and loading conditions of the button shear setup onto load and the crack driving forces at the interface crack tip will be discussed. The simulation results will be correlated with existing experimental data for different material combinations. Means to an estimation of adhesion strength values from the button shear test will be provided.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011