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Manufacture of a 3-D package using Low Temperature Co-fired Ceramic technology

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3 Author(s)
Lacrotte, Y. ; Inst. of Integrated Syst., Heriot-Watt Univ., Edinburgh, UK ; Kay, R.W. ; Desmulliez, M.P.Y.

This paper presents the feasibility of sculpting 3D microstructures in a single layer of unfired green tape ceramic. To achieve this result, a powder blasting machine was used to pattern the soft layer. This process is based on the abrasive power of micro particles propelled at high speed towards a substrate. To create 3D structures, the angle of incidence of those particles was varied. Using this method, we have realised sloped wall, sharp edges and transverse channels inside the green tape ceramic. Sub-150 μm oblique via walls were also produced with angles ranging from 40° to 60°. These vias can also be filled with conductive paste to accommodate microelectronic needs. The assembly of these 3-D layers into LTCC package can be envisaged for the fabrication of innovative packages for microfluidic and electronic applications.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011