By Topic

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Ng, J.H.-G. ; Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK ; Ssekitoleko, R.T. ; Flynn, D. ; Kay, R.W.
more authors

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Published in:

Microelectronics and Packaging Conference (EMPC), 2011 18th European

Date of Conference:

12-15 Sept. 2011