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Enhancing circuits and systems supply noise sensitivity characterization using on-package droop inducers

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3 Author(s)
Vikinski, O. ; Microprocessors & Chipset Div., Intel Corp., Haifa, Israel ; Ben-Ezra, R. ; Huang, J.H.S.

This paper presents design and implementation of noise inducer devices mounted on the package of a full featured microprocessor. Such assembly enables vast sensitivity characterization capabilities of the chip circuits and systems to supply noises. Prototype vehicle encompassing five separate 45nm CMOS process droop inducer devices stimulating four separate supply rails of a 32nm CMOS process microprocessor is reported. Multiple empirical results arising from the combined operation of the noise inducers and the microprocessor chip were obtained and analyzed.

Published in:

SoC Design Conference (ISOCC), 2011 International

Date of Conference:

17-18 Nov. 2011