Referenced Items are not available for this document.
This article proposes a new class of sensors for built-in test in RF devices. These sensors are placed in close proximity to the DUT on the same substrate without being electrically connected to it. Instead, they monitor it by virtue of being subjected to the same process variations. The authors also describe other types of sensors they have studied, including DC probes, an envelope detector, and a current sensor.
Published in:
Design & Test of Computers, IEEE
(Volume:28
,
Issue:
6
)
Date of Publication: Nov.-Dec. 2011
- Page(s):
- 76 - 84
- ISSN :
- 0740-7475
- INSPEC Accession Number:
- 12444044
- Digital Object Identifier :
- 10.1109/MDT.2011.131
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 09 January 2012
- Issue Date :
- Nov.-Dec. 2011
- Sponsored by :
- IEEE Council on Electronic Design and Automation
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