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We present a theory of metal-cavity nanolasers and our progress in experiments of metal-cavity surface-emitting microlasers and nanoLEDs with electrical injection at room temperature. After substrate removal, the devices are flip-chip bonded to silicon. The fabrication concepts represent significant progress toward integration of active nanophotonic devices with silicon electronics.
Microopics Conference (MOC), 2011 17th
Date of Conference: Oct. 30 2011-Nov. 2 2011