Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Extraction of electrical model for CBGA500

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xie Wenjun ; Beijing Microelectron. Technol. Inst., Beijing, China ; Cao Yusheng ; Yao Quanbin

The Ceramic Ball Grid Array or CBGA package, is a promising choice for high speed digital applications such as CPU, DSP and FPGA. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. This paper is based on CBGA500 package, designed by the package center of Beijing Microelectronics technology institute for CPU, the wideband electrical parameters of one signal path for a typical 500 I/O (1.0 mm pitch) CBGA package structure, were modeled precisely using EM simulation software Ansoft HFSS and ADS of the Agilent company. The simulation result shows the electrical parameter model we got can characterize the selected signal path very well from 0 to 350MHz, and the Scatting parameter difference between the wideband model and the HFSS model is less than 5 percent.

Published in:

Advanced Packaging Materials (APM), 2011 International Symposium on

Date of Conference:

25-28 Oct. 2011