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Extraction of electrical model for CBGA500

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3 Author(s)
Xie Wenjun ; Beijing Microelectron. Technol. Inst., Beijing, China ; Cao Yusheng ; Yao Quanbin

The Ceramic Ball Grid Array or CBGA package, is a promising choice for high speed digital applications such as CPU, DSP and FPGA. Excellent attributes of this advanced package include miniaturized footprint, good electrical performance and excellent thermal characteristics. This paper is based on CBGA500 package, designed by the package center of Beijing Microelectronics technology institute for CPU, the wideband electrical parameters of one signal path for a typical 500 I/O (1.0 mm pitch) CBGA package structure, were modeled precisely using EM simulation software Ansoft HFSS and ADS of the Agilent company. The simulation result shows the electrical parameter model we got can characterize the selected signal path very well from 0 to 350MHz, and the Scatting parameter difference between the wideband model and the HFSS model is less than 5 percent.

Published in:

Advanced Packaging Materials (APM), 2011 International Symposium on

Date of Conference:

25-28 Oct. 2011