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This paper looks into a cooling solution to reduce temperature of hot spots on electronic chips through the use of a thermal ground plane to spread heat from the hot spots. Thermal ground plane is a layer of carbon composition with superior thermal conductivity being deposited on the substrate. Heat spreading effect of the thermal ground plane is observed with a calibrated infra red thermal imaging camera. By comparing the thermal distribution of the surfaces on set-up with and without thermal ground, it can be seen that the set-up with thermal ground plane is better at spreading heat away from the hotspot to cooler region. From the thermal distributions, it is estimated that under the experiment conditions, the set up with thermal ground plane will be able to dissipate 9.68% more heat than set up without thermal ground plane.