By Topic

Effects of high-pressure high-temperature sintering on the microstructures of Pb0.55Te0.45

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Chen Bo ; Inst. of High Temp. & High Pressure Phys., Wuhan Univ. of Technol., Wuhan, China ; Sun Zhen-Ya ; Li Ming-Fa ; Wang Shan-Yu
more authors

The n-type nonstoichiometric Pb0.55Te0.45 materials were prepared by melting and quenching combined with a subsequent high pressure high temperature (HPHT) sintering. After adequately annealed at 623 K in the argon atmosphere, the microstructures and thermal transferring performance of the prepared samples have been systematically investigated. The results show that the grains of samples were apparently refined, as well as a large quantity of twisty layered structure and numerous particles with a size of ~200nm distributing in the grain boundary can be observed. These refined microstructures significantly block the transports of phonons, and result in a remarkable reduction of the lattice thermal conductivity compared with the corresponding melting ingots.

Published in:

Electronics, Communications and Control (ICECC), 2011 International Conference on

Date of Conference:

9-11 Sept. 2011