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Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates

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3 Author(s)
Val Dyadyuk ; CSIRO ICT Centre, Sydney, NSW 2122, Australia ; Leigh Stokes ; Thomas Merkle

Early results of implementation of System-in-Package integration technique in the E-band using multi-chip module laminated (MCM-L) techniques on multi-layer liquid crystal polymer substrate are presented. Several prototypes have been developed with commercial and proprietary millimeter wave monolithic integrated circuits embedded into LCP MCM-L. Feasibility of this technique has been demonstrated with measured performance close to simulation predictions.

Published in:

Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International

Date of Conference:

15-16 Sept. 2011