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A multilayer organic package with embedded 60-GHz antennas and fully integrated with a 60-GHz phased-array transmitter or receiver chip is demonstrated. The package includes sixteen phased-array antennas, an open cavity for housing the flip-chip attached RF chip, and interconnects operating at DC-66 GHz. The 28 mm 28 mm ball grid array package is manufactured using printed circuit board processes and uses a combination of liquid-crystal polymer and glass-reinforced laminates, allowing excellent 60-GHz interconnect and antenna performance. The measured return loss and gain of each antenna from 56 to 66 GHz are and , respectively. Finally, the packaged transmitter and receiver chipsets, each working with a heat sink, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s using 16-quadrature amplitude modulation single-carrier and orthogonal frequency division multiplexing schemes.
Components, Packaging and Manufacturing Technology, IEEE Transactions on (Volume:1 , Issue: 11 )
Date of Publication: Nov. 2011