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Heterogeneous electronics based systems are driven by an increasing demand for smaller form factor, faster and higher-density interconnection, and miniaturisation all at a cheaper cost. 3D packaging, using through-silicon-via technology, is positioned to satisfy these requirements and Carbon Nanotubes as an interconnection technology is gaining extensive interest in the community. This paper provides a summary of the latest advances in such technology, and discusses the challenges that need to be addressed by the community in terms of modeling technologies.
Date of Conference: 11-15 May 2011