Cart (Loading....) | Create Account
Close category search window

Optimisation and fabrication of low-stress, low-temperature silicon oxide cantilevers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Kshirsagar, A. ; Dept. of Electr. Eng., Indian Inst. of Technol. - Bombay, Mumbai, India ; Duttagupta, S.P. ; Gangal, S.A.

Modern lab-on-a-chip systems can benefit from integration of nanoelectromechanical system/microelectromechanical system (NEMS/MEMS) and complementary metal-oxide semiconductor technology with emphasis on low temperature processing. In the present work process, parameters for deposition of silicon oxide (SiOx) by inductively coupled plasma chemical vapour deposition (ICPCVD) at low temperature (70°C) are optimised. The sacrificial layer poly(methyl methacrylate) (PMMA) is in-house prepared and optimised. This PMMA sacrificial solution not only gives a low cost wide range of viscosity solutions, but it is also low temperature NEMS process compatible. With optimisations mentioned above, it has been possible to fabricate the whole device without exceeding the thermal budget 100°C. To the best of the authors° knowledge, this is the first report on sub-100°C, surface micromachined SiOx cantilevers deposited by ICPCVD and using PMMA as the sacrificial layer for low temperature NEMS applications.

Published in:

Micro & Nano Letters, IET  (Volume:6 ,  Issue: 7 )

Date of Publication:

July 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.