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Direct bonding of piezoelectric materials onto Si

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7 Author(s)
Eda, K. ; Dev. Eng. Dev. Centre, Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan ; Tomita, Yoshihiro ; Sugimoto, Masato ; Ogura, Tetsuyoshi
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New composite semiconductor-piezoelectric materials fabricated by direct bonding technology are reported. The fabrication process, analysis of the bonded interface microstructures, and their applications are also reported

Published in:

Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on  (Volume:2 )

Date of Conference:

18-21 Aug 1996