By Topic

Wafer level tracking enhances particle source isolation in a manufacturing environment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
K. Zinke ; UOG Defect Reduction Group, Digital Equipment Corp., Hudson, MA, USA ; R. Abugov

The successful manufacture of ULSI integrated circuits at Digital now requires the elimination of particle nucleation sites whose size can be well below the resolution of available on-line defect detection tools. Traditional sequential wafer inspections can often find specific operations which give rise to particles, but they may slow production to unacceptable levels, especially when problems are intermittent. This paper documents a new strategy which combines randomization of wafer order with wafer level tracking and patterned wafer particle detection to detect submicron sources of defects. Case studies illustrate the ability of this method to detect nucleation sites invisible to defect detection systems, and reduce the number of inspections required to trace specific defect sources. Cases where application of this technique should not be used are also provided

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI

Date of Conference:

14-16 Nov 1994