By Topic

Mini environment systems. Enabling technology for flexible fabs of the future

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Baldwin, K. ; Asyst Technol., Milpitas, CA, USA ; Castrucci, P. ; Williams, M.

Summary form only given. As the industry moves from one generation of IC technology to the next with smaller and smaller submicron devices and larger and larger wafers, severe constraints will be placed on manufacturing fabs. Conventional fabs typically have four generations of product running at once: advanced technology in development; growing technology ramping-up; current technology at its peak; and one generation declining and going out. Fab flexibility will be a key requirement as technological changes demand substantial tooling changes. We will describe a Minienvironment System that integrates the many tooling and process requirements the “Fab of the Future”

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI

Date of Conference:

14-16 Nov 1994