A New Spatially Rearranged Bundle of Mixed Carbon Nanotubes as VLSI Interconnection

Scaling of device dimensions down to nanometer range helps achieve unprecedented switching speed and multifunctional processing capabilities of nanoelectronic circuits and systems. However, interconnect constraints in the existing and emerging applications are expected to become the primary bottlenecks unless radical change is introduced in the design and technology of on-chip signal communication medium. In response to this demand, various novel and innovative interconnect solutions like carbon nanotube (CNT) are currently being explored as alternatives to metal wires. This paper proposes a unique structure of mixed CNT bundle with a specific arrangement of single-wall and multi-wall CNTs in the bundle. A comprehensive modeling and analysis of the conductance, inductance, and capacitance of the proposed mixed CNT bundle reveals that there will be no significant decrease in the overall conductance of the bundle, but the structural arrangement clearly reduces capacitive crosstalk between neighboring signal lines. Inductive crosstalk is seen to remain unchanged.