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Characterizing the failure envelope of a conductive adhesive

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4 Author(s)
Olliff, D. ; Dept. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Gaynes, M. ; Kodnani, R. ; Zubelewicz, A.

The importance of flip chip technology is beginning to grow as the use of such technology is seen to be more and more advantageous. The search for alternatives to lead-based solder has also led to the study of conductive adhesives as a possible replacement for solder interconnect technology. Under a grant from DARPA, the IBM and Universal Instruments Corporations have sought to create a flip chip package using conductive adhesive interconnects. This paper presents the preliminary results of mechanical testing designed to determine the static failure envelope of the adhesive. A difference in fracture mode was observed between the tensile and compressive samples indicating that a change in failure mechanism occurred. Further work is being conducted in order to isolate the specific failure mechanisms involved

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997

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