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Development of low loop, long length, hydrostatically extruded bonding wire

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3 Author(s)
H. Lichtenberger ; Williams Adv. Mater., Buffalo, NY, USA ; G. Toea ; M. Zasowski

Recent developments in the microelectronics field have led to an increasing need for low loop and long length Bonding Wires. In order to develop a product to meet these needs, we have investigated the effects of Be, Cu, Ag, Ca, Pt and Al additions to high purity 5Ns gold in conjunction with a hydrostatic wire extrusion process. Bonding wire break loads and recrystallization temperatures are plotted for varying levels of these dopants. Low loop and long length Gold bonding wire is achieved by optimizing the chemistry for high recrystallization temperature and strength

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997