Referenced Items are not available for this document.
Since the advent of flip chip packaging technology in the solid logic technology (SLT) of IBM in the early 1960s, a great deal of thought and energy has been invested toward making flip chip cost competitive with wirebonding. While this goal has been occasionally met in the intervening years, the relentless progress of wirebond technology has repeatedly regained the advantage
Published in:
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Date of Conference: 9-12 Mar 1997
- Page(s):
- 113 - 114
- Meeting Date :
- 09 Mar 1997-12 Mar 1997
- Print ISBN:
- 0-7803-3818-9
- INSPEC Accession Number:
- 5658126
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAPM.1997.581270
- Product Type:
- Conference Publications
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