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Built-in passive components in multilayer ceramics for wireless applications

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3 Author(s)
Nelson, C. ; Kyocera America Inc., San Diego, CA, USA ; Sigliano, R. ; Makihara, C.

Operating frequencies required for today's wireless telecommunication electronics have increased from hundreds of megahertz to a few gigahertz (GHz). The use of the GHz band is successful in the wireless market because passive and active components in microwave integrated circuits (MIC) or monolithic microwave integrated circuits (MMIC) packages meet the need for high performance and lower cost. There are still a few technical problems that need to be resolved in these packages. Among these is that high Q inductors and capacitors cannot be built cost effectively in the sizes required. Technological developments have yielded newer low temperature cofiring sintered glass ceramic materials incorporating integrated passive components cost effectively. These integrated components include inductors, capacitors, impedance matching SAW filter circuits and band pass filters. This presentation describes the development of this material and design of a test vehicle to determine suitability to high frequency wireless applications

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997