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Mechanical properties of Sn-In and Pb-In solders at low temperature

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3 Author(s)
Jones, W.K. ; Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA ; Liu, Y.Q. ; Shah, M.

The growing number of applications using high temperature superconductors (HTS) has created new requirement for increasing the range of temperatures in which electronic assemblies can operate. Typically, eutectic lead-tin solders lose ductility below -150°C. In this paper, new solder formulations were evaluated for cryogenic applications. The mechanical properties of PbIn and Sn-In solders were determined over the temperature range -200°C to 100°C using the uniaxial tensile test, with the following results. The strength of two types of solder increases almost linearly with decreasing temperature. However, it was evident that the Sn-In alloying solders possess higher strength than the Pb-In (50 Pb/50 In) solder at low temperatures. For both types of solder, the total elongation decreases with decreasing temperature, and all of the solders displayed superplasticity at temperatures greater than 50°C. There was also doubling of the uniform elongation below -50°C for all of the tested solders. The deformation and fracture processes of the solders were investigated, and their fracture mechanism is proposed

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997