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Practical applications of photo-defined micro-via technology (PhotoLinkTM)

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2 Author(s)
McDermott, B.J. ; Continental Circuits Inc., FL, USA ; Tryzbiak, S.

Current high density SMT designs and many of the future designs, as we move towards Chip-Scale Packaging (CSP), will require increased price/performance of the PCB. Conventional mechanical drilling and blind/buried via technologies are reaching their design limitations. Photoimageable dielectrics may be the most cost effective and the least time to market of the higher density technologies. This is a fundamental change in the way we make PCB's. It will provide the process capability in terms of via size to meet the longer term interconnect density requirements. This technology is available today to enable the implementation of higher density SMT and CSP designs. It provides significant advantages in terms of physical design rules and also electrical design

Published in:

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Date of Conference:

9-12 Mar 1997