Referenced Items are not available for this document.
This article explores the benefits and the challenges of 3D design and discusses novel techniques to integrate predictive cooling control with chip-level thermal-management methods such as job scheduling and voltage frequency scaling. Using 3D liquid-cooled systems with intelligent runtime management provides an energy-efficient solution for designing single-chip many-core architectures.
Published in:
Micro, IEEE
(Volume:31
,
Issue:
4
)
Date of Publication: July-Aug. 2011
- Page(s):
- 63 - 75
- ISSN :
- 0272-1732
- INSPEC Accession Number:
- 12175384
- Digital Object Identifier :
- 10.1109/MM.2011.39
- Product Type:
- Journals & Magazines
- Date of Publication :
- 19 May 2011
- Date of Current Version :
- 28 July 2011
- Issue Date :
- July-Aug. 2011
- Sponsored by :
- IEEE Computer Society
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