Ceramic Substrates

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2 Author(s)

This chapter contains sections titled:

  • Ceramics in Electronic Packaging

  • Electrical Properties of Ceramic Substrates

  • Mechanical Properties of Ceramic Substrates

  • Physical Properties of Ceramic Substrates

  • Design Rules

  • Thin Film on Ceramics

  • Thick Films on Ceramics

  • Low-Temperature Cofired Ceramics (LTCC)

  • HTCC Fabrication Process

  • High-Current Substrates

  • Summary

  • This chapter contains sections titled:

  • References

  • Exercises