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Modelling of metal degradation in power devices under active cycling conditions

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5 Author(s)
Kanert, W. ; Infineon Technol. AG, Neubiberg, Germany ; Pufall, R. ; Wittler, O. ; Dudek, R.
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Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model has to go beyond a simple Coffin-Manson type model to capture the essential influencing parameters.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Date of Conference:

18-20 April 2011