Cart (Loading....) | Create Account
Close category search window
 

One-Megapixel Monocrystalline-Silicon Micromirror Array on CMOS Driving Electronics Manufactured With Very Large-Scale Heterogeneous Integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Zimmer, F. ; Fraunhofer Inst. for Photonic Microsyst. (IPMS), Dresden, Germany ; Lapisa, M. ; Bakke, T. ; Bring, M.
more authors

In this paper, we demonstrate the first high-resolution spatial-light-modulator chip with 1 million tilting micromirrors made of monocrystalline silicon on analog high-voltage complementary metal-oxide-semiconductor driving electronics. This device, as result of a feasibility study, shows good optical and excellent mechanical properties. The micromirrors exhibit excellent surface properties, with a surface roughness below 1-nm root mean square. Actuated micromirrors show no imprinting behavior and operate drift free. Very large-scale heterogeneous integration was used to fabricate the micromirror arrays. The detailed fabrication process is presented in this paper, together with a characterization of the SLM devices. Large arrays of individually controllable micromirrors are the enabling component in high-perfomance mask-writing systems and promising for high throughput deep-ultraviolet maskless lithography systems. The adoption of new materials with enhanced characteristics is critical in meeting the challenging demands with regard to surface quality and operation stability in the future. Very large-scale heterogeneous integration may enable virtually any solid-state material to be integrated together with CMOS electronics.

Published in:

Microelectromechanical Systems, Journal of  (Volume:20 ,  Issue: 3 )

Date of Publication:

June 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.