Referenced Items are not available for this document.
This paper concentrates on some of these new challenges that designers must face in power delivery. We will discuss QUALCOMM's effort with EDA vendors to develop power distribution network (PDN) analysis flows in order to address the power delivery issues in 3DICs, and emphasize the necessity of a standard reduced power model (SRPM) to enable the 3D PDN analysis flows.
Published in:
3D Systems Integration Conference (3DIC), 2010 IEEE International
Date of Conference: 16-18 Nov. 2010
- Page(s):
- 1 - 4
- Print ISBN:
- 978-1-4577-0526-7
- INSPEC Accession Number:
- 11945604
- Conference Location :
- Munich
- Digital Object Identifier :
- 10.1109/3DIC.2010.5751433
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
